June 13, 2011
9:30am - 9:45am

Welcome Address and Introduction (PDF)
Madhavan Swaminathan
Joseph M. Pettit Professor in Electronics, School of Electrical and Computer Engineering
Director, Interconnect and Packaging Center
Georgia Tech

9:45am - 10:40am

Keynote Talk: SiP, SOC, and TSV: Issues in Getting from Technologies to Systems (PDF)
Greg Taylor
Fellow, Intel Corp.

10:40am - 11:20am

Thermo-mechanical Challenges from the best engineering practices prospective for TSV technology
Gamal-Refai Ahmed
Fellow, AMD Corp.

11:20am - 12:00pm

Hybrid electromagnetic simulation methods for 3D package integration (PDF)
Erping Li
Principal Scientist/Director, Electronics and Photonics department, A*STAR, 
Institute of High Performance Computing, Singapore

12:00pm - 1:00pm - Lunch (boxed lunch provided to registrants)

1:00pm - 1:40pm

Packaging for high temperature automotive electronic applications (PDF)
Varughese Mathew
Packaging Solutions Development,
Freescale Semiconductor, Inc.

1:40pm - 2:20pm

Enabling Technologies for 3D Integration - Temporary Bonding and Aligned Permanent Bonding (PDF)
Eric Pabo
Business Development Manager, EV Group

2:20pm - 2:45pm - Break (Refreshments provided)

2:45pm - 3:25pm

Challenges in Interconnects
Ravi Mahajan
Senior Principal Engineer, Intel Corp.

3:25pm - 4:05pm

Update on the 3D Enablement Center, an SIA-SEMATECH-SRC program (PDF)
Jonathan Candelaria
Director, Interconnect and Packaging Sciences, SRC

4:05pm - 4:45pm

Energy and Reliability of 3D  Systems: Opportunities and Challenges
Saibal Mukhopadhyay
Assitant Professor, School of Electrical and Computer Engg., Georgia Tech

4:45pm - 5:15pm – Break

5:15pm - 6:15pm - Social Hour (for registrants)
Research poster presentation by UG students
Facilities poster presentation by Staff

6:15pm - 8:00pm - Dinner (for registrants)

June 14, 2011
6:30pm - 7:30pm

Perspective on Packaging and Interconnect,
Paul Kohl
Hercules, Inc./Thomas L. Gossage Chair and Regents' Professor
Director, Interconnect Focus Center, Georgia Tech